November 2018 - Computer Hardware News and Reviews

Samsung 860 QVO Drives with QLC 3D V-NAND Memory and Lower Prices

Samsung Electronics will bring to the market a new QVO SSD drives using memory chips with four bits per cell (QLC). Judging by the published SSD specifications, the 860 QVO SSD will become the first Samsung drive on QLC-memory. Samsung announced the release of consumer solid state drives utilizing 64-layer QLC 3D chips V-NAND at the end of the summer, and finally the new drives have been listed for pre-order on several online stores.

G.SKILL extends its portfolio of RAM modules with the new Trident Z Royal DDR4 RAM module kits intended for use with Intel’s 8th and 9th generation processor family. The new RAM modules will be sold in kits of two to eight RAM modules and they will have eight zones of RGB leds on the top of the RAM modules with gold or silver heatsink for the RAM chips.

AMD is preparing the Ryzen 3000U mobile hybrid CPUs, in addition to the Ryzen 3000 line for desktop systems. New AMD APUs traditionally come out a bit later than regular desktop APUs . Due to the fact that the new engineering sample of Ryzen 7 3700U low-power APU appeared in the benchmark databases of UserBenchmark and SiSoftware Sandra benchmarks, some characteristics of the future APUs became clear.

HP introduced the updated Pavilion x360 series, which include two laptops models: a model with 14″ screen and a model with 15.6″ screen. The main difference between the new products is the reduced thickness of the laptop case from 12.7 mm to 6.5 mm. Also, there is a second camera with a wide-angle lens and a viewing angle of 120 °.

Month:

Samsung 860 QVO Drives with QLC 3D V-NAND Memory and Lower Prices

G.Skill Announces the new Trident Z Royal DDR4 RAM Module Kits with RGB Lighting

The new AMD Ryzen 7 3700U APU with Zen2 Architecture and Picasso RX Vega 10 Graphics

HP Pavilion x360 Laptops now have the 8th Generation of Intel Core CPUs